1、 Stamping type plate splitter: mechanical cutting principle

Core structure: composed of an upper die (punch), a lower die (die), a cylinder/hydraulic system, and a positioning device.

Working process:

Positioning: Place the PCB on the lower mold and fix the position using positioning pins or vacuum suction.

Stamping: The cylinder or hydraulic system drives the upper die to move downward, and the punch and die form a shear surface. Pressure is applied at the preset dividing line (such as V-groove or perforation line) of the PCB, causing the material to fracture due to stress concentration.

Separation: The broken single PCB is taken out through the material chute or mechanical arm of the lower mold.

Features:

Advantages: High efficiency (up to 5000 times/hour), suitable for large-scale standardized production; Low mold cost (about 50-20000 yuan per set of molds).

Limitations: The mold needs to be customized, and the changeover time is long (about 2-4 hours); Only suitable for straight line segmentation, with poor adaptability to complex shaped PCBs.

2、 Knife type slitting machine: rolling cutting principle

Core structure: composed of an upper circular blade, a lower straight blade, a transmission system, and a worktable.

Working process:

Fixed PCB: Place the PCB with V-slot on the lower straight knife and fix it with pressure blocks.

Cutting: The upper circular blade rolls under the drive of the motor while moving horizontally, forming a shear force with the lower straight blade, and cutting the PCB along the V-groove path.

Separation: After cutting is completed, the PCB naturally breaks along the V-groove, and individual PCBs are removed by conveyor belts or manually.

Features:

Advantages: Low equipment cost (about 30000 to 80000 yuan), simple operation; Suitable for PCBs with a thickness of 0.6-3.2mm.

Limitations: The cutting stress is high (which may cause slight deformation of the plate edge), and it is only suitable for straight line segmentation; The round knife needs to be replaced after wear and tear (with a lifespan of approximately 100000 cutting cycles).

3、 Milling cutter type splitting machine: CNC milling principle

Core structure: composed of high-speed spindle, milling cutter, motion control system (X/Y/Z axis), CCD vision system, and dust removal device.

Working process:

Positioning: Identify the Mark points (positioning marks) on the PCB through the CCD vision system, and automatically compensate for panel offset (accuracy ± 0.05mm).

Milling: The high-speed spindle (with a speed of up to 60000rpm) drives the milling cutter (with a diameter of 0.8-3.0mm) to move along a predetermined path, cutting the material through the cutting edge to achieve segmentation.

Dust removal: During the cutting process, the dust collection device (air volume ≥ 300m ³/h) absorbs dust in real time to prevent short circuits or pollution.

Features:

Advantages: Can cut any shape (such as circular or irregular); Low stress (suitable for PCBs containing precision components); High precision (± 0.02mm).

Limitations: High equipment costs (approximately 200000 to 500000 yuan); The milling cutter needs to be replaced regularly (with a lifespan of approximately 5000-10000 meters for cutting length).

4、 Laser Splitting Machine: Hot Melt/Gasification Principle

Core structure: composed of laser generator, galvanometer scanning system, motion platform, and smoke exhaust system.

Working process:

Focused laser: A laser generator (such as CO ₂ laser or ultraviolet laser) generates a high-energy beam, which is focused onto the surface of the PCB through a galvanometer scanning system.

Cutting: Laser energy instantly vaporizes or melts the material, forming a cutting seam (width 0.05-0.2mm).

Smoke exhaust: The smoke exhaust system absorbs the smoke generated by gasification to prevent pollution.

Features:

Advantages: Non contact cutting (no mechanical stress); Suitable for ultra-thin boards (thickness ≤ 0.1mm) or flexible boards; Extremely high accuracy (± 0.01mm).

Limitations: High equipment costs (approximately 500000 to 2 million yuan); The laser power needs to be matched with the material (such as FR4 requiring 10-30W, ceramic requiring 50W or more); Cutting edges may carbonize (requiring post-treatment).

5、 V-CUT Splitting Machine: Stress Fracture Principle

Core structure: composed of a V-shaped knife, a breaking mechanism, and a worktable.

Working process:

Pre cut V-groove: First, use a V-knife to cut a V-groove on the back of the PCB (angle 30 ° -45 °, depth 1/3-2/3 of the board thickness).

Breaking: Place the PCB on the breaking mechanism and apply pressure through a cylinder or robotic arm to break the PCB along the V-groove.

Features:

Advantages: Low cost (equipment costs about 10000-30000 yuan); High efficiency (suitable for rule-based assembly).

Limitations: Only applicable to straight line segmentation; When broken, it may damage the edge components of the board (a safety distance of ≥ 2mm should be reserved).